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MICROWAVE CORPORATION
v02.1201
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
Features
SMT mmWave Package Gain > 15 dB Broadband Performance Saturated Output Power: +24 dBm Positive Supply: +5V to +7V
8
AMPLIFIERS - SMT
Typical Applications
This amplifier is ideal for use as a power amplifier for 25.5 - 33.5 GHz applications: * LMDS * Microwave Radio
Functional Diagram
General Description
The HMC300LM1 is a broadband surface mount medium power amplifier that operates between 25.5 and 33.5 GHz. A 0.25 um power pHEMT process is used to achieve efficient gain and output power performance. High volume surface mount re-flow assembly techniques may be used to mount the amplifier to the end user's PCB. The LM1 package eliminates the need for wire bonding or die attach mounting. The amplifier provides 15 dB of gain and +24 dBm of saturated output power across various microwave radio bands. This millimeter wave amplifier requires no external RF matching components and minimal DC bypass components. The amplifier operates from a +6V Vdd and a -0.35V Vgg gate bias.
Electrical Specifications, TA = +25 C, Vdd = +6V
Parameter Frequency Range Gain Gain Variation Over Temperature Input Return Loss Output Return Loss Reverse Isolation Output 1 dB Compression (P1dB) Saturated Output Power (Psat) Output Third Order Intercept (IP3) (Two-tone Input Power = -5 dBm each tone) Supply Current (Idd)(Vdd = +6.0 Vdc)* 5 5 35 20 21 21 13 Min. Typ. 25.5 - 33.5 16 0.06 8 8 50 23 24 26 220 275 22 0.07 Max. Units GHz dB dB/C dB dB dB dBm dBm dBm mA
*Adjust Vgg 1 between -1.0 to 0V to achieve Idd = 220 mA typical.
8 - 34
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
v02.1201
MICROWAVE CORPORATION
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
Broadband Gain & Return Loss
25 20 15
Gain vs. Temperature @ Vdd = +6V
25
8
AMPLIFIERS - SMT
8 - 35
20
RESPONSE (dB)
10 5 0 -5 -10 -15 -20 -25 20 25 30 FREQUENCY (GHz) 35 40 0 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz) 5
+25 C +85 C -40 C
GAIN (dB)
S21 S11 S22
15
10
Input Return Loss vs. Temperature @ Vdd = +6V
0
Output Return Loss vs. Temperature @ Vdd = +6V
0
RETURN LOSS (dB)
-10
RETURN LOSS (dB)
+25 C +85 C -40 C
-5
-5
-10
-15
-15
+25 C +85 C -40 C
-20 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
-20 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
P1dB Output Power vs. Temperature @ Vdd = +6V
30 25
Output IP3 vs. Temperature @ Vdd = +6V
THIRD ORDER INTERCEPT POINT (dBm)
35 30 25 20 15 10 5 0 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
+25 C +85 C -40 C
Output P1dB (dBm)
20 15 10 5 0 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
+25 C +85 C -40 C
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
MICROWAVE CORPORATION
v02.1201
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
8
AMPLIFIERS - SMT
Gain vs. Vdd
25
Input Return Loss vs. Vdd
0
20
15
RETURN LOSS (dB)
-5
GAIN (dB)
-10
10
Vdd=+5V Vdd=+6V Vdd=+7V
-15
5
Vdd=+5V Vdd=+6V Vdd=+7V
0 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
-20 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
Output Return Loss vs. Vdd
0
P1dB Output Power vs. Vdd
30 25
RETURN LOSS (dB)
Output P1dB (dBm)
-5
20 15 10 5 0
Vdd=+5V Vdd=+6V Vdd=+7V
-10
-15
Vdd=+5V Vdd=+6V Vdd=+7V
-20 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
24
25
26
27
28
29
30
31
32
33
34
35
FREQUENCY (GHz)
PSAT Output Power vs. Vdd
30 25 20 15 10 5 0 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
Vdd=+5V Vdd=+6V Vdd=+7V
IP3 vs. Vdd
THIRD ORDER INTERCEPT POINT (dBm)
35 30 25 20 15 10 5 0 24 25 26 27 28 29 30 31 32 33 34 35 FREQUENCY (GHz)
Vdd=+5V Vdd=+6V Vdd=+7V
Psat (dBm)
8 - 36
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
v02.1201
MICROWAVE CORPORATION
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
Absolute Maximum Ratings
Drain Bias Voltage (Vdd1, Vdd2) Drain Bias Current (Idd) Gate Bias Voltage (Vgg1) RF Input Power (RFin)(Vdd = +6.0 Vdc) Channel Temperature Continuous Pdiss (T = 85 C) (derate 15.03 mW/C above 85 C) Thermal Resistance (channel to ground paddle) Storage Temperature Operating Temperature +5.0 Vdc 500 mA -2.0 to +0.4 Vdc +10 dBm 150 C 0.977 W
8
AMPLIFIERS - SMT
NOTES: 1. MATERIAL: PLASTIC 2. PLATING: GOLD OVER NICKEL 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. ALL TOLERANCES ARE 0.005 [ 0.13]. 5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND. 6.
67 C/W -65 to +150 C -40 to +85C
Outline Drawing
Pin 1 2 3 4 5 6 7 8
Function GND Vdd1 Vdd2 RF OUT GND Vgg1 GND RF IN
* INDICATES PIN 1
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
8 - 37
MICROWAVE CORPORATION
v02.1201
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
8
AMPLIFIERS - SMT
Evaluation PCB
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground (GSG) probes for testing. Suggested probe pitch is 400m (16 mils). Alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors.
Evaluation Circuit Board Layout Design Details
Layout Technique Material Dielectric Thickness Microstrip Line Width CPWG Line Width CPWG Line to GND Gap Ground Via Hole Diameter C1 C2 Micro Strip to CPWG Rogers 4003 with 1/2 oz. Cu 0.008" (0.20 mm) 0.018" (0.46 mm) 0.016" (0.41 mm) 0.005" (0.13 mm) 0.008" (0.20 mm) 100 pF Capacitor, 0402 Pkg. 33,000 pF Capacitor, 1206 Pkg.
LM1 Package Mounted to Evaluation PCB For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
8 - 38
v02.1201
MICROWAVE CORPORATION
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
Suggested LM1 PCB Land Pattern Tolerance: 0.003" ( 0.08 mm)
8
AMPLIFIERS - SMT
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
8 - 39
v02.1201
MICROWAVE CORPORATION
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
8
AMPLIFIERS - SMT
Application Circuit
Recommended Component Values C1 C2 100 pF 33,000 pF
Note: Vgg1 should be applied to Pin 6 to provide appropriate bias level to Amplifier. Voltage level should be adjusted until nominal Idd of 220 mA is reached.
8 - 40
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
v02.1201
MICROWAVE CORPORATION
HMC300LM1
SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz
Recommended SMT Attachment Technique
Preparation & Handling of the LM1 Millimeterwave Package for Surface Mounting
The HMC LM1 package was designed to be compatible with high volume surface mount PCB assembly processes. The LM1 package requires a specific mounting pattern to allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. This PCB layout pattern can be found on each LM1 product data sheet. It can also be provided as an electronic drawing upon request from Hittite Sales & Application Engineering.
225
8
AMPLIFIERS - SMT
8 - 41
200
TEMPERATURE ( C)
175 150 125 100
75 Follow these precautions to avoid permanent damage: Cleanliness: Observe proper handling procedures to ensure 50 clean devices and PCBs. LM1 devices should remain in their 25 original packaging until component placement to ensure no 0 1 2 3 4 5 6 7 8 contamination or damage to RF, DC & ground contact areas. TIME (min) Static Sensitivity: Follow ESD precautions to protect against Recommended solder reflow profile ESD strikes. for HMC LM1 SMT Package General Handling: Handle the LM1 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoid damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid. Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user's experience and should be compatible with the metallization systems used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes. Solder Paste Application Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reflow
The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder reflow profile is suggested above. Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies. The thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the location of the device. Follow solder paste and oven vendor's recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of 235C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235C.
Cleaning
A water-based flux wash may be used.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com
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